Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10720459 | Imaging element package and camera module having a slit formed in an adhesive connecting a flexible substrate and another member to address differences in linear expansion coefficients | Yuta Momiuchi, Yuji Takaoka, Hirokazu Nakayama, Kiyohisa Tanaka, Miyoshi Togawa +1 more | 2020-07-21 |
| 10636714 | Semiconductor device, manufacturing method of semiconductor device, and electronic apparatus | — | 2020-04-28 |