Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10720459 | Imaging element package and camera module having a slit formed in an adhesive connecting a flexible substrate and another member to address differences in linear expansion coefficients | Yuta Momiuchi, Yuji Takaoka, Kiyohisa Tanaka, Miyoshi Togawa, Hirokazu Seki +1 more | 2020-07-21 |