Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10681807 | Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor package | Norihiko Sakamoto, Hiroshi Yokota, Shintaro Hashimoto, Shinji Tsuchikawa, Shin Takanezawa | 2020-06-09 |