Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10681807 | Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor package | Norihiko Sakamoto, Hiroshi Yokota, Shintaro Hashimoto, Katsuhiko Nawate, Shin Takanezawa | 2020-06-09 |
| 10604641 | Thermosetting resin composition and prepreg and laminate both made with the same | Masanori Akiyama, Tomohiko KOTAKE | 2020-03-31 |