Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10816900 | Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film | Katsuya Takemura, Masashi Iio, Koji Hasegawa, Kenji Funatsu | 2020-10-27 |