Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770320 | Universal chip batch-bonding apparatus and method | Song Guo, Yuebin Zhu, Hai Xia | 2020-09-08 |
| 10763235 | Batch bonding apparatus and bonding method | Xiaoyu Jiang, Hai Xia, Song Guo | 2020-09-01 |
| 10748800 | Chip bonding apparatus and method | Yuebin Zhu, Hai Xia, Bin Yu, Song Guo, Yaping Ge | 2020-08-18 |
| 10656507 | Focusing and leveling measurement device and method | Qi Cheng, Xuting Wu | 2020-05-19 |
| 10658327 | Chip bonding apparatus and bonding method | Tianming Wang, Xiaoyu Jiang, Hai Xia | 2020-05-19 |