Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770320 | Universal chip batch-bonding apparatus and method | Yuebin Zhu, Feibiao Chen, Hai Xia | 2020-09-08 |
| 10763235 | Batch bonding apparatus and bonding method | Xiaoyu Jiang, Hai Xia, Feibiao Chen | 2020-09-01 |
| 10748800 | Chip bonding apparatus and method | Yuebin Zhu, Feibiao Chen, Hai Xia, Bin Yu, Yaping Ge | 2020-08-18 |
| 10593678 | Methods of forming semiconductor devices using aspect ratio dependent etching effects, and related semiconductor devices | Sanh D. Tang, Vlad Temchenko, Shivani Srivastava | 2020-03-17 |