Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10804626 | Press-fit power module and related methods | Jie Chang, Huibin Chen, Tiburcio A. Maldo | 2020-10-13 | $15,441,000 |
| 10741480 | Leadframe with sockets for solderless pins | Tiburcio A. Maldo | 2020-08-11 | $13,850,000 |
| 10566713 | Press-fit power module and related methods | Jie Chang, Huibin Chen, Tiburcio A. Maldo | 2020-02-18 | $7,790,000 |
| 10553517 | High power module semiconductor package with multiple submodules | Jie Chang, Huibin Chen, Jerome Teysseyre | 2020-02-04 | $14,173,000 |