Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10665525 | Heat transfer for power modules | Roveendra PAUL, Dukyong LEE | 2020-05-26 |
| 10553517 | High power module semiconductor package with multiple submodules | Jie Chang, Huibin Chen, Keunhyuk LEE | 2020-02-04 |
| 10546847 | Substrate interposer on a leadframe | Elsie Agdon Cabahug, Marie Clemens Ypil Quinones, Maria Cristina Estacio, Romel N. Manatad, Chung-Lin Wu | 2020-01-28 |