Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10706880 | Electrically conductive solder non-wettable bond pads in head gimbal assemblies | Robbee L. Grimm, Greg A. Schmitz, Venkateswara Rao Inturi | 2020-07-07 |
| 10646943 | Method of forming electrical connections using optical triggering for solder | Scott Matzke, Paul Davidson, Christopher R. Libby | 2020-05-12 |
| 10643645 | Slider with bondable surface opposite suspension trace | Paul Davidson, Scott Damon Matzke, Christopher Unger | 2020-05-05 |
| 10600436 | Slider with trailing edge top bond pad interconnect | Paul Davidson, Scott Matzke | 2020-03-24 |
| 10556284 | Method of forming electrical connections with solder dispensing and reflow | Paul Davidson, Ralph Kevin Smith | 2020-02-11 |