Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10706880 | Electrically conductive solder non-wettable bond pads in head gimbal assemblies | Greg A. Schmitz, Venkateswara Rao Inturi, Aaron Michael Collins | 2020-07-07 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10706880 | Electrically conductive solder non-wettable bond pads in head gimbal assemblies | Greg A. Schmitz, Venkateswara Rao Inturi, Aaron Michael Collins | 2020-07-07 |