Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10820427 | Simultaneous and selective wide gap partitioning of via structures using plating resist | Drew G. Doblar | 2020-10-27 |
| 10811210 | Multilayer printed circuit board via hole registration and accuracy | Douglas Ward Thomas | 2020-10-20 |
| 10757819 | Method of forming a laminate structure having a plated through-hole using a removable cover layer | Dale Kersten | 2020-08-25 |
| 10667390 | Simultaneous and selective wide gap partitioning of via structures using plating resist | Dale Kersten, George Dudnikov | 2020-05-26 |