Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10757819 | Method of forming a laminate structure having a plated through-hole using a removable cover layer | Shinichi Iketani | 2020-08-25 |
| 10667390 | Simultaneous and selective wide gap partitioning of via structures using plating resist | Shinichi Iketani, George Dudnikov | 2020-05-26 |