Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847408 | Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip | Raghuveer S. Makala, Senaka Kanakamedala, Jian Chen | 2020-11-24 |
| 10741572 | Three-dimensional memory device having multilayer word lines containing selectively grown cobalt or ruthenium and method of making the same | Rahul Sharangpani, Raghuveer S. Makala, Yanli Zhang | 2020-08-11 |
| 10700086 | Three-dimensional flat NAND memory device having high mobility channels and methods of making the same | Raghuveer S. Makala, Fei Zhou, Senaka Kanakamedala | 2020-06-30 |
| 10622368 | Three-dimensional memory device with semicircular metal-semiconductor alloy floating gate electrodes and methods of making thereof | Senaka Kanakamedala, Raghuveer S. Makala, Rahul Sharangpani, Somesh Peri, James Kai | 2020-04-14 |