Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847408 | Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip | Raghuveer S. Makala, Yao-Sheng Lee, Jian Chen | 2020-11-24 |
| 10748925 | Three-dimensional memory device containing channels with laterally pegged dielectric cores | Masanori Tsutsumi, Manabu Kakazu, Raghuveer S. Makala | 2020-08-18 |
| 10700086 | Three-dimensional flat NAND memory device having high mobility channels and methods of making the same | Raghuveer S. Makala, Fei Zhou, Yao-Sheng Lee | 2020-06-30 |
| 10622368 | Three-dimensional memory device with semicircular metal-semiconductor alloy floating gate electrodes and methods of making thereof | Raghuveer S. Makala, Rahul Sharangpani, Somesh Peri, Yao-Sheng Lee, James Kai | 2020-04-14 |
| 10622369 | Three-dimensional memory device including contact via structures that extend through word lines and method of making the same | Fei Zhou, Raghuveer S. Makala, Hiroyuki Kinoshita, Yanli Zhang, James Kai +2 more | 2020-04-14 |
| 10529620 | Three-dimensional memory device containing word lines formed by selective tungsten growth on nucleation controlling surfaces and methods of manufacturing the same | Rahul Sharangpani, Raghuveer S. Makala, Fei Zhou, Adarsh Rajashekhar, Fumitaka Amano +1 more | 2020-01-07 |