Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10665580 | Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the same | Naohiro Hosoda, Tetsuya Shirasu, Yuji Fukano, Akio Nishida | 2020-05-26 |