Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10793711 | Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using same | Jae-Hyun Kim, Tae Shin EOM, Eun Jung Lee, Su Mi Im | 2020-10-06 |
YL
Yoon Man Lee
Overall (2020): #212,046 of 565,922Top 40%
1
Patents 2020