Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10793711 | Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using same | Yoon Man Lee, Jae-Hyun Kim, Tae Shin EOM, Eun Jung Lee | 2020-10-06 |