Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10756076 | Semiconductor package | — | 2020-08-25 |
| 10553514 | Substrate strip including conductive plane around periphery of chip mounting regions and method of manufacturing semiconductor package using the same | Keung Beum Kim, Wonchul Lim, Dongsuk Kim | 2020-02-04 |