Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553514 | Substrate strip including conductive plane around periphery of chip mounting regions and method of manufacturing semiconductor package using the same | Keung Beum Kim, Dongsuk Kim, Yonghoon Kim | 2020-02-04 |