Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784244 | Semiconductor package including multiple semiconductor chips and method of manufacturing the semiconductor package | Won-Gil Han, Seung Lo Lee, Sung-Il Cho | 2020-09-22 |
| 10679972 | Method of manufacturing multi-chip package | Won-Gil Han, Byong-Joo Kim, Jae-heung Lee, Seung-Weon Ha | 2020-06-09 |
| 10658326 | Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire | Won-Gil Han, Sangho An, Jae-heung Lee, Seungweon Ha | 2020-05-19 |