Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658326 | Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire | Won-Gil Han, Sangho An, Yong Je Lee, Jae-heung Lee | 2020-05-19 |