Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867857 | Method of cutting substrate and method of singulating semiconductor chips | Chang-Seong Jeon, Seung-Hun Shin, Jae-Kyung Yoo | 2020-12-15 |
TL
Teak-Hoon Lee
Overall (2020): #250,877 of 565,922Top 45%
1
Patents 2020