Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867857 | Method of cutting substrate and method of singulating semiconductor chips | Chang-Seong Jeon, Jae-Kyung Yoo, Teak-Hoon Lee | 2020-12-15 |
| 10672823 | Image sensors | Duk-seo Park | 2020-06-02 |