Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872875 | Bonding head and method for bonding semiconductor package, and semiconductor package | Sanghoon Lee, Jiwon Shin, Hyunggil Baek, Jongho Lee | 2020-12-22 |
MK
Minkeun Kwak
Overall (2020): #345,180 of 565,922Top 65%
1
Patents 2020