Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872875 | Bonding head and method for bonding semiconductor package, and semiconductor package | Sanghoon Lee, Jiwon Shin, Minkeun Kwak, Jongho Lee | 2020-12-22 |
HB
Hyunggil Baek
Overall (2020): #443,199 of 565,922Top 80%
1
Patents 2020