Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854528 | Semiconductor package including organic interposer | Akihisa Kuroyanagi, Yeong A Kim, Eun Sil Kim | 2020-12-01 |
| 10847476 | Semiconductor package | Jae-Kul Lee, Seon Ho Lee | 2020-11-24 |
| 10692791 | Electronic component package with electromagnetic wave shielding | Akihisa Kuroyanagi, Jae-Kul Lee | 2020-06-23 |
| 10541187 | Semiconductor package including organic interposer | Akihisa Kuroyanagi, Yeong A Kim, Eun Sil Kim | 2020-01-21 |