Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854528 | Semiconductor package including organic interposer | Jun Woo Myung, Yeong A Kim, Eun Sil Kim | 2020-12-01 |
| 10692791 | Electronic component package with electromagnetic wave shielding | Jun Woo Myung, Jae-Kul Lee | 2020-06-23 |
| 10541187 | Semiconductor package including organic interposer | Jun Woo Myung, Yeong A Kim, Eun Sil Kim | 2020-01-21 |