Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672730 | Semiconductor package having reduced internal power pad pitch | Hongying Zhang, HongLiang Cai | 2020-06-02 |
| 10658335 | Heterogenous 3D chip stack for a mobile processor | Yu Lin, Jinghua Zhu, Guofang Jiao | 2020-05-19 |