HC

HongLiang Cai

Futurewei Technologies: 1 patents #189 of 471Top 45%
Overall (2020): #447,323 of 565,922Top 80%
1
Patents 2020

Issued Patents 2020

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10672730 Semiconductor package having reduced internal power pad pitch Shiqun Gu, Hongying Zhang 2020-06-02