Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811364 | Shielded electronic modules and methods of forming the same utilizing plating and double-cut singulation | Stephen Parker, Jerry Holt, John Davisson, Rommel Quintero Nevarez | 2020-10-20 |
| 10777524 | Using an interconnect bump to traverse through a passivation layer of a semiconductor die | Michael Meeder | 2020-09-15 |
| 10607960 | Substrate structure with selective surface finishes for flip chip assembly | Robert Hartmann | 2020-03-31 |
| 10553545 | Electromagnetic shielding for integrated circuit modules | Donald Joseph Leahy, James Edwin Culler, Jr. | 2020-02-04 |