Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777524 | Using an interconnect bump to traverse through a passivation layer of a semiconductor die | Thomas Scott Morris | 2020-09-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777524 | Using an interconnect bump to traverse through a passivation layer of a semiconductor die | Thomas Scott Morris | 2020-09-15 |