Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784205 | Electronic package | Chu-Chin Hu | 2020-09-22 |
| 10745818 | Method of fabricating package substrates | Chun-Hsien Yu, Pao-Hung Chou | 2020-08-18 |
| 10580739 | Package substrate and associated fabrication method with varying depths for circuit device terminals | Chu-Chin Hu | 2020-03-03 |