Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784205 | Electronic package | Shih-Ping Hsu | 2020-09-22 |
| 10580739 | Package substrate and associated fabrication method with varying depths for circuit device terminals | Shih-Ping Hsu | 2020-03-03 |