Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607963 | Chip package for two-phase cooling and assembly process thereof | Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Michael A. Gaynes, Jeffrey D. Gelorme +4 more | 2020-03-31 |