Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10785868 | Multilayer printed wiring board and method for producing multilayer printed wiring board | Kenichi Toshimitsu, Daisuke Nii, Koichi Isaji, Hiroyuki Fujisawa | 2020-09-22 |
| 10543661 | Metal foil with resin, and metal-clad laminate and circuit board using same | Akihiro Yamauchi, Yoshiaki Esaki, Takayoshi Ozeki, Hiroaki UMEHARA, Hiroharu Inoue | 2020-01-28 |