Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10785868 | Multilayer printed wiring board and method for producing multilayer printed wiring board | Kenichi Toshimitsu, Daisuke Nii, Hiroyuki Fujisawa, Yoshihiko Nakamura | 2020-09-22 |