Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10868945 | Light-field camera and method using wafer-level integration process | Jau-Jan Deng, Chia-Yang Chang, Wei-Feng Lin | 2020-12-15 |
| 10734437 | Interposer and chip-scale packaging for wafer-level camera | Chia-Yang Chang, Yi Qin | 2020-08-04 |