Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10868945 | Light-field camera and method using wafer-level integration process | Teng-Sheng Chen, Jau-Jan Deng, Wei-Feng Lin | 2020-12-15 |
| 10734437 | Interposer and chip-scale packaging for wafer-level camera | Teng-Sheng Chen, Yi Qin | 2020-08-04 |
| 10611108 | Yardless lens assemblies and manufacturing methods | Mao-Chin Wang, Shao-Fan Kao | 2020-04-07 |