Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861821 | Packaging method and package structure of wafer-level system-in-package | Hailong LUO | 2020-12-08 |
| 10861895 | Image capturing assembly and packaging method thereof, lens module and electronic device | Da-Jung Chen | 2020-12-08 |
| 10811385 | Wafer-level system-in-package structure and electronic apparatus thereof | — | 2020-10-20 |
| 10755979 | Wafer-level packaging methods using a photolithographic bonding material | Hu SHI | 2020-08-25 |
| 10756056 | Methods and structures for wafer-level system in package | — | 2020-08-25 |