HS

Hu SHI

NI Ningbo Semiconductor International: 1 patents #8 of 13Top 65%
Overall (2020): #443,859 of 565,922Top 80%
1
Patents 2020

Issued Patents 2020

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10755979 Wafer-level packaging methods using a photolithographic bonding material Mengbin Liu 2020-08-25