Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10685852 | Chip packaging device and alignment bonding method thereof | Po-Tsung Hsieh, Chia-Ming Yang, Shih-Wen Tseng, Ya-Wen Tsai, Ya-Wen Chuang | 2020-06-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10685852 | Chip packaging device and alignment bonding method thereof | Po-Tsung Hsieh, Chia-Ming Yang, Shih-Wen Tseng, Ya-Wen Tsai, Ya-Wen Chuang | 2020-06-16 |