CY

Chia-Ming Yang

HT Hiwin Technologies: 2 patents #3 of 60Top 5%
CU Chang Gung University: 1 patents #3 of 39Top 8%
NU National Cheng Kung University: 1 patents #5 of 79Top 7%
Overall (2020): #57,540 of 565,922Top 15%
4
Patents 2020

Issued Patents 2020

Patent #TitleCo-InventorsDate
10685852 Chip packaging device and alignment bonding method thereof Po-Tsung Hsieh, In-Gann Chen, Shih-Wen Tseng, Ya-Wen Tsai, Ya-Wen Chuang 2020-06-16
10663042 External circulation ball screw Yi Sun 2020-05-26
10612632 Ball screw structure with detection function Ying-Ju Lin, Ping-Huan Hsieh, Min-Hsiu Wu 2020-04-07
10551340 Capacitor-based fluid sensing units and operating methods thereof Chao-Sung Lai, Hsin-Yin Peng, Wei Zeng, Chun Chen 2020-02-04