Issued Patents 2020
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872852 | Wafer level package utilizing molded interposer | — | 2020-12-22 |
| 10833052 | Microelectronic package utilizing embedded bridge through-silicon-via interconnect component and related methods | — | 2020-11-10 |
| 10825783 | Semiconductor packages and devices | Tieh-Chiang Wu | 2020-11-03 |
| 10825799 | Semiconductor structure | — | 2020-11-03 |
| 10818625 | Electronic device | — | 2020-10-27 |
| 10818536 | Microelectronic devices including redistribution layers | Hsu Chiang, Neng-Tai Shih | 2020-10-27 |
| 10811309 | Semiconductor structure and fabrication thereof | Chih-Ching Lin | 2020-10-20 |
| 10770424 | Semiconductor structure and method of manufacturing thereof | — | 2020-09-08 |
| 10763262 | Method of preparing semiconductor structure | — | 2020-09-01 |
| 10763199 | Semiconductor package structure and method for preparing the same | — | 2020-09-01 |
| 10685845 | Method for preparing a semiconductor structure | — | 2020-06-16 |
| 10629522 | Semiconductor package and method for fabricating the same | — | 2020-04-21 |
| 10566229 | Microelectronic package structures including redistribution layers | Hsu Chiang, Neng-Tai Shih | 2020-02-18 |
| 10553433 | Method for preparing a semiconductor structure | — | 2020-02-04 |
| 10529570 | Method for preparing a semiconductor structure | — | 2020-01-07 |
| 10529689 | Semiconductor package with multiple coplanar interposers | — | 2020-01-07 |
| 10529586 | Method of manufacturing semiconductor device | — | 2020-01-07 |