Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818536 | Microelectronic devices including redistribution layers | Shing-Yih Shih, Hsu Chiang | 2020-10-27 |
| 10566229 | Microelectronic package structures including redistribution layers | Shing-Yih Shih, Hsu Chiang | 2020-02-18 |