Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734297 | Ag underlayer-attached metallic member, Ag underlayer-attached insulating circuit substrate,semiconductor device, heat sink-attached insulating circuit substrate, and method for manufacturing Ag underlayer-attached metallic member | Shuji Nishimoto | 2020-08-04 |
| 10607907 | Ceramic-aluminum conjugate, power module substrate, and power module | Yoshirou Kuromitsu, Kazuhiro Akiyama, Toshiyuki Nagase, Nobuyuki Terasaki, Yuichi Ikuhara +2 more | 2020-03-31 |
| 10600719 | Bonded body, power module substrate with heat sink, heat sink, method of manufacturing bonded body, method of manufacturing power module substrate with heat sink, and method of manufacturing heat sink | Nobuyuki Terasaki | 2020-03-24 |
| 10573798 | Thermoelectric conversion module and thermoelectric conversion device | Yoshinobu Nakada, Toshiyuki Nagase, Masahito Komasaki | 2020-02-25 |
| 10526252 | Ceramic/aluminum joined body, insulating circuit board, power module, LED module, and thermoelectric module | Nobuyuki Terasaki | 2020-01-07 |