Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818585 | Copper/ceramic joined body, insulated circuit board, method for producing copper/ceramic joined body, and method for producing insulated circuit board | — | 2020-10-27 |
| 10798824 | Method for manufacturing insulated circuit board, insulated circuit board, and thermoelectric conversion module | Toyo Ohashi | 2020-10-06 |
| 10607907 | Ceramic-aluminum conjugate, power module substrate, and power module | Yoshirou Kuromitsu, Kazuhiro Akiyama, Toshiyuki Nagase, Yoshiyuki Nagatomo, Yuichi Ikuhara +2 more | 2020-03-31 |
| 10600719 | Bonded body, power module substrate with heat sink, heat sink, method of manufacturing bonded body, method of manufacturing power module substrate with heat sink, and method of manufacturing heat sink | Yoshiyuki Nagatomo | 2020-03-24 |
| 10526252 | Ceramic/aluminum joined body, insulating circuit board, power module, LED module, and thermoelectric module | Yoshiyuki Nagatomo | 2020-01-07 |