Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10566274 | Semiconductor device and semiconductor package including plural solder ball sets each corresponding to a pair of differential input and differential output signals | Isao Ozawa, Yasuo Kudo, Koichi Nagai, Katsuya Murakami | 2020-02-18 |