Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872844 | Semiconductor device with sealed semiconductor chip | — | 2020-12-22 |
| 10566274 | Semiconductor device and semiconductor package including plural solder ball sets each corresponding to a pair of differential input and differential output signals | Isao Maeda, Yasuo Kudo, Koichi Nagai, Katsuya Murakami | 2020-02-18 |