Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10825756 | Chip attached to a die pad having a concave structure | Hideharu Kojima | 2020-11-03 |
| 10784165 | Semiconductor device and dicing method | Shingo Masuko, Kazuo Fujimura, Ichiro Mizushima | 2020-09-22 |